摘要：

Metallized laminated materials are obtained by coating a solder- resistant core material with a non-conductive polymer film, and subsequent activation and wet-chemical metallization of the polymer film, the activation being carried out, without oxidative pretreatment, on the polymer film before it has hardened completely, and the final hardening only being effected after the metallization. The materials thus metallized are suitable for the production of printed circuits.

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