Laser etching method
申请(专利)号:
08/391745
申请日期:
02/21/1995
公开/公告号:
US6617541
公开/公告日期:
09/09/2003
申请(专利权)人:
Koninklijke Philips Electronics N.V. (Eindhoven, NL)
被引量:
摘要:
A method of furnishing a substrate with a patterned film of electrode material making use of a laser beam, whereby a stack is made by providing a surface of the substrate at least with a layer of an assistant material and an overlying layer of the said electrode material, the assistant material being capable of decomposition upon heating with the aid of the said laser beam, subsequent to which the stack is, in accordance with a desired pattern, locally irradiated with the laser beam so as to heat the assistant material to at least its decomposition temperature, consequent upon which the locally overlying electrode material is caused to detach.
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