摘要：

A reticle assembly, exposure system, and method for exposing each of a plurality of levels of a single die or device dies of a semiconductor wafer to a pattern of radiation on a site-by-site exposure basis are disclosed. Radiation patterning means between a source of radiation and the semiconductor wafer pattern the radiation onto the semiconductor wafer and a stepping means incrementally moves the semiconductor wafer relative to the patterning means for exposing the device dies, one at a time, in succession. The patterning means includes a reticle assembly having a plurality of reticles arranged in a coplanar array with each reticle having a respective different die exposure pattern.

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