摘要：

Selected areas of the surface of a substrate, such as the surface of a substrate of single crystalline silicon having at least one CCD image sensor along an opposed surface of the substrate, is coated with a metal by coating the surface to be coated with a layer of a photoresist. The substrate is then supported, such as by a vacuum chuck, with the photoresist layer being exposed. A mask, which is supported above the substrate, is moved close to but spaced from the photoresist layer. The substrate is then moved, such as by means of an x-y-&thgr; aligner table on which the chuck is mounted, until a pattern on the mask is aligned with areas of the substrate surface. A light directed through the substrate and the mask from below the substrate and viewed by a microscope above the mask assists in achieving the alignment. The mask is then lowered onto the photoresist layer and lies thereon under only its own weight. Radiation is then directed onto the photoresist layer through the mask. The mask is then lifted from the photoresist and the substrate is removed from the chuck. After developing the photoresist layer to expose areas of the substrate surface, a metal film is coated on the exposed areas of the substrate surface. The remaining photoresist is then removed.

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