THE MANUFACTURING METHOD OF A COPPER ELECTROLITIC REFINING FOR NEGATIVE PLATE

阅读量:

12

申请(专利)号:

KR20180144619

申请日期:

2018-11-21

公开/公告号:

KR101963379B1

公开/公告日期:

2019-03-28

申请(专利权)人:

HANA METAL CO., LTD.

发明人:

S Hong

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摘要:

The present invention relates to a method to manufacture a negative plate for copper electrolytic refining and the objective of the present invention is to closely attach a hanger to an electrodeposition plate bonding unit to almost remove defect, such as corrosion, and the like, by intrusion of sulfuric acid so as to extend a life of the negative plate. According to the present invention, the method to manufacture a negative plate for copper electrolytic refining comprises: a hanger setting step of longitudinally inserting a second member formed with a rectangular copper rod into a first member made of a stainless steel material; a hanger welding step of bonding the first and second members to be a hanger formed by mutually combining the first and second members in a longitudinal direction; a post-processing step of correcting the hanger made in the hanger welding step; and a main welding step of welding an electrodeposition plate in a longitudinal direction of the center of one side on a cross section of the hanger completely corrected in the post-processing step. Accordingly, the hanger is closely attached to the electrodeposition plate bonding unit, such that defect, such as corrosion, and the like, by intrusion of sulfuric acid is almost removed, thereby providing an advantage of extending a life of the negative plate.

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