METAL OXIDE POWDER FOR HIGH QUALITY POLISHING AND PROCESS FOR PRODUCING THE SAME

阅读量:

5

申请(专利)号:

KR20030035206

申请日期:

2003-06-02

公开/公告号:

KR20030094078A

公开/公告日期:

2003-12-11

申请(专利权)人:

SAMSUNG CORNING CO., LTD.

发明人:

MH AhnYG JungHJ KwonIY Lee

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摘要:

PURPOSE: Provided are metal oxide powder for high quality polishing, which gives high polishing contact area, high polishing velocity, and little scratches, and a process for producing the metal oxide powder by controlling the coagulation of first particles properly. CONSTITUTION: The metal oxide powder has a coagulation degree(alpha=6/(Sxpx d(XRD))) of 1.1-2.0, a coagulation scale(beta=weight average particle diameter/d(XRD)) of 3-10, an average adjacent particle number of 2-3, and a fine particle diameter of 10-200nm, wherein S is a specific surface area of powder, p is a density of powder, and d(XRD) is a fine particle diameter of powder obtained by X-ray diffraction analysis. And the metal oxide powder is selected from the group consisting of alumina, silica, ceria, zirconia, titanium oxide, manganese oxide, tin oxide, zinc oxide powder, and a powder mixture thereof. And the process for producing the metal oxide powder comprises the steps of: mixing a precursor of the metal oxide with a diluent to prepare a mixture containing 40-70wt%(based on the whole) of the diluent; milling the mixture; calcining the milled mixture; and cleansing the calcined mixture with a solvent to remove the diluent.

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