Image plane measurement method, and device manufacturing method exposure method, and exposure apparatus
申请(专利)号:
JP20060529261
申请日期:
2005-07-21
公开/公告号:
JP4683232B2
公开/公告日期:
2011-05-18
申请(专利权)人:
株式会社ニコン
摘要:
Moves in the scanning direction (RST) is the reticle stage (50), by illuminating illumination light in (IL) an area including a mark region reticle (R) on a predetermined mark is formed the main controller, is formed through a projection optical system (PL) the aerial image of one mark, is measured using (59) the aerial image measuring device spatial image at least present in the mark area. The main controller repeats while moving in the scanning direction of the reticle stage, the measurement of the aerial image such. The main controller calculates the scanned image plane image of the pattern on the basis of the measurement result of the aerial image of each mark in the moving each position, was formed on the reticle is formed by the projection optical system. Based on the calculation result, the main controller performs the focus leveling control of wafer during the scanning exposure. Thus, without using a sensor of the reticle (mask) position measurement, to realize a high-precision exposure.
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