摘要：

PURPOSE: Provided is a latent hardener, which is hardenable at low temperature in a short time and has excellent shelf stability, and thus is useful for an adhesive for connecting semiconductor chips or tape carrier packages to a substrate by hot compression. Also, provided are a manufacturing method thereof and an adhesive comprising the same. CONSTITUTION: The latent hardener comprises hardener particles(31) based on either or both of metal chelate and metal alcoholate, and a capsule for coating the surface of the hardener particles(31). The metal chelate and the metal alcoholate are preferably aluminum chelate and aluminum alcoholate, respectively. Particularly, the capsule is based on a fluororesin. The capsule may be formed by attaching resin particles having an average particle diameter smaller than that of the hardener particles on the surface of the hardener particles, and melting the resin particles.

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