Packaging container for electronic part
申请(专利)号:
AU20010015525
申请日期:
2000-11-27
公开/公告号:
AU1552501A
公开/公告日期:
2001-06-12
申请(专利权)人:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
被引量:
摘要:
An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.
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