Low humidity curing for moisture-curing coating
申请(专利)号：
JP20130546684
申请日期：
2011-12-23
公开/公告号：
JP5898695B2
公开/公告日期：
2016-04-06
申请(专利权)人：
アクゾ ノーベル コーティングス インターナショナル ビー ヴィ
摘要：
The invention is directed to a low humidity cure moisture curable coating composition which includes a moisture cure binder component that includes: a moisture curable binder material and at least one organic solvent; and a humectant component that includes a slow evaporating volatile humectant; wherein the humectant is present in an amount sufficient to increase the cure rate of the coating and to provide a cured coating having acceptable mechanical and cosmetic properties at a relative humidity of 50% or lower; and the invention is also directed to a method for curing moisture curable coating compositions under low humidity conditions.
展开
相似文献
参考文献
引证文献
辅助模式
引用
文献可以批量引用啦~
欢迎点我试用！
