The thermoplastic resin composition

阅读量:

14

申请(专利)号:

JP特願平2-510047

申请日期:

19900611

公开/公告号:

JP第2803006号B2

公开/公告日期:

19980924

申请(专利权)人:

住友化学工業株式会社

摘要:

A thermoplastic resin composition comprising: 100 parts by weight of a composition composed of 95 to 5 % by weight of at least one polyolefin resin (A) selected from the group consisting of homopolymers and copolymers of ethylene or an α-olefin and products of modification thereof with a polyfunctional compound (E) or an unsaturated monomer (L) and 5 to 95 % by weight of at least one polyphenylene ether resin (B) selected from the group consisting of polyphenylene ether, products of modification thereof with the compound (E) or the monomer (L), and compositions comprising the same and an aromatic vinyl polymer resin (M), and 0.001 to 10 parts by weigth of a dinitro diamine (D) of general formula (I), wherein X represents a divalent open-chain aliphatic, cycloaliphatic or aromatic group which may contain halogen or oxygen therein; R' represents hydrogen or an open-chain aliphatic, cycloaliphatic or aromatic group provided that two nitrogen atoms may be bound to each other through X and R1 to form a ring R1 when both of X and R1 are open-chain aliphatic groups; and R?2 and R3 represent each independently hydrogen or an alkyl group having 1 to 12 carbon atoms, or R?2 and R3 may be combined together to form a ring.

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