摘要：

A method for producing an electronic apparatus casing including: a step of forming a copper layer by way of non-electrolytic plating onto a casing body made from a magnesium or magnesium alloy material shaped into a predetermined configuration; a step of forming a nickel layer on the copper layer by way of non-electrolytic plating; a step of carrying out a surface grinding and a honing to the nickel layer; a step of forming a hard transparent glass layer by using a colloid solution containing SiO. sub.2 and Na.sub.2 O; and a step of forming a silica layer on the hard glass layer by using a partially hydrolyzed solution of an organic silicate ester.

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