摘要：

As the industries of cell phone and LCD TV were vigorously flourishing and the manufacturing requirements for LCD glass substrate were getting higher, the thermal fracture cutting technology (TFCT) has progressively become the main technology for LCD glass substrate cutting. Due to using laser as the heat source, the TFCT has many advantages, such as uniform heating, small heat effect zone, and high cutting speed, smooth cutting surface and low residual stress, etc. Moreover, a general laser ablation processing or traditional diamond wheel cutting does not have the last two advantages. The article presents a mixed processing of glass substrate, which consists of TFCT and laser ablation mechanisms, and how to enhance the cutting speed with little ablation laser energy. In this study, a 10W Nd:YAG laser and a 40WCO2laser are used as the heat source of TFCT and laser ablation processing, respectively. The result indicates that the speed of the mixed processing is more than twice the speed of TFCT. Furthermore, after the mixed processing, the residual stresses in the glass substrates are also smaller.

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