Sensitized polyimides and circuit elements thereof
申请(专利)号：
US19740522807
申请日期：
1974-11-11
公开/公告号：
US3954570A
公开/公告日期：
1976-05-04
申请(专利权)人：
AMP INCORPORATED
被引量：
摘要：
A process for preparation of an activated or sensitized polyimide polymer, deposition of various catalysts on the sensitized polymer and subsequent plating on said sensitized and catalyzed surface of a metal, e. g., nickel, cobalt, copper, or gold from an electroless bath; improved adhesion, avoidance of blistering, etc. are observed; the process is capable of producing useful printed circuits such as for mounting integrated circuit chips.
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