摘要：

A packaging for semiconductor modules such as multi chip modules (MCM). At least one via is created on saw street region of a substrate having circuit components. The substrate is transfer molded and the transfer molded substrate is partially singulated from a first surface along with the via to create a groove. The partially singulated substrate including the groove on the saw street region and the via is coated or plated with a conducting material for RF shielding. Accordingly, the conducting material and a ground terminal of the substrate are connected through the via on the substrate.

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