摘要：

The compositions of chemical copper plating baths which produce fine copper patterns on PF with a good external appearance, low porosity, and high adhesive strength (690-825 N/m) were selected. It was found that these copper plating baths, in contrast to others, permit preparing copper deposits consisting of small (500-700 Angstrom) grains of copper of similar size uniformly distributed over the surface of the substrate, closely packed, and reproducing the relief of the surface of the substrate in the first layers of the deposit. It is shown that confluence of the individual copper grains, accompanied by a decrease in the AS of the copper patterns, takes place with an increase in the thickness of the copper deposits from the chemical copper plating bath.

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