Gas plasma treatment for modification of surface wetting properties
申请(专利)号:
US19920864434
申请日期:
1992-04-06
公开/公告号:
US5344462A
公开/公告日期:
1994-09-06
申请(专利权)人:
PLASMA PLUS
被引量:
摘要:
Efficiency of low pressure gas plasma processes is increased by addition of small quantities of water vapor to the primary gas constituting the plasma. Treated fabrics and polymer films show decreased wetting angle and increased capillary absorption, which beneficially affects the material's susceptibility to dyeing and impregnation.
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