Method for encapsulation of electronic devices

阅读量:

20

申请(专利)号:

09/968167

申请日期:

09/28/2001

公开/公告号:

US20030062518

公开/公告日期:

04/03/2003

申请(专利权)人:

AUCH MARK GUENTHER EWALD FANG LIM SHUANG JIN CHUA SOO LING LOW BEE

被引量:

437

摘要:

An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

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被引量:40

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