SYSTEM FOR APPLYING ABSORBENT MATERIAL TO A SUBSTRATE
申请(专利)号:
US20050039239
申请日期:
2005-01-19
公开/公告号:
US2005186351A1
公开/公告日期:
2005-08-25
申请(专利权)人:
PAUL Y. FUNG;ANTHONY D. ONUSCHAK;RAYMOND J. HULL;JOHN ORENGA
被引量:
摘要:
A method and system for applying an adhesive/superabsorbent mixture to a substrate, the method and system being adapted for heating an adhesive and superabsorbent polymer mixture to a first temperature at a first pressure, the first temperature being less than the boiling temperature of said mixture at the first pressure; heating the mixture through a heat exchanger at a second pressure, the second pressure being higher than the first pressure, the heat exchanger being adapted to raise the temperature of the mixture to a second temperature that is higher than the first temperature; and selectively applying the mixture to a substrate.
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