Integrated circuit device and method of manufacturing the same
申请(专利)号:
US201615377723
申请日期:
2016-12-13
公开/公告号:
US2017309568A1
公开/公告日期:
2017-10-26
申请(专利权)人:
SAMSUNG ELECTRONICS CO., LTD.
国省代号:
KR
被引量:
摘要:
An integrated circuit device includes a first conductive line and a second conductive line that are spaced apart from each other and extend in a first direction to be parallel to each other; and a contact pad including a pad body including a first branch portion from which the first conductive line branches and a second branch portion from which the second conductive line branches and a loop branch portion that is located between the first branch portion and the second branch portion and protrudes from the pad body. Related devices and fabrication methods are also discussed.
展开
通过文献互助平台发起求助,成功后即可免费获取论文全文。
相似文献
参考文献
引证文献
辅助模式
引用
文献可以批量引用啦~
欢迎点我试用!