摘要：

A composite foil having an electrolytically formed copper or copper- containing layer and a second electrolytically formed copper layer of a thickness which is not self-supporting, the copper layer and the second metal layer being separated by a coating of a release agent. A process for producing such a composite foil wherein the thin copper layer is formed in a single plating bath containing a copper acid electrolyte. A method for producing copper clad elements suitable for the manufacture of printed circuits from such foils and laminates so produced.

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