Thermal paste for improving thermal contacts

阅读量:

46

申请(专利)号:

WO2004US21734

申请日期:

2004-07-07

公开/公告号:

WO2005006403A2

公开/公告日期:

2005-01-20

申请(专利权)人:

THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK

发明人:

Deborah D.L. Chung

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被引量:

265

摘要:

A thermally conductive paste including porous agglomerates of carbon particles dispersed in a paste-forming vehicle is disclosed. The paste is useful as a thermally conductive interface material between a heat or cold source and an object. The paste is particularly useful as a thermally conductive interface material between a heat source and a heat sink. Apparatus and a method of removing heat from a heat source utilizing thermally conductive pastes of the present invention are also disclosed.

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2009
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