Thermal paste for improving thermal contacts
申请(专利)号:
WO2004US21734
申请日期:
2004-07-07
公开/公告号:
WO2005006403A2
公开/公告日期:
2005-01-20
申请(专利权)人:
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
被引量:
摘要:
A thermally conductive paste including porous agglomerates of carbon particles dispersed in a paste-forming vehicle is disclosed. The paste is useful as a thermally conductive interface material between a heat or cold source and an object. The paste is particularly useful as a thermally conductive interface material between a heat source and a heat sink. Apparatus and a method of removing heat from a heat source utilizing thermally conductive pastes of the present invention are also disclosed.
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