THOROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
申请(专利)号:
10/594040
申请日期:
10/05/2004
公开/公告号:
US20070176294
公开/公告日期:
08/02/2007
被引量:
摘要:
A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension wiring provided in the through hole and extending on one side of the through wiring board up to a position at a predetermined distance from the through hole, and a conductive bump formed on the through extension wiring except the through hole position.
展开
通过文献互助平台发起求助,成功后即可免费获取论文全文。
请先登入
相似文献
参考文献
引证文献
辅助模式
0
引用
文献可以批量引用啦~
欢迎点我试用!