摘要：

Polyimide materials are treated in such fashion as to impart to the treated surface thereof good bondability toward other materials, such as thin films of copper foil, to provide composite laminated articles useful in the industrial arts such as for printed circuitry and the like. The treatment consists essentially in subjecting the surface of the polyimide material to a solution, preferably anhydrous, of an alkali metal hydroxide in a high boiling glycol or glycol ether such as ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, tetraethylene glycol, and the mono-ethers and di-ethers of such glycols.

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