Ablation layers to prevent pitting in laser peening
申请(专利)号：
US20050240676
申请日期：
2005-09-30
公开/公告号：
US2007075062A1
公开/公告日期：
2007-04-05
申请(专利权)人：
LLOYD A. HACKEL
摘要：
A hybrid ablation layer that comprises a separate under layer is applied to a material to prevent pitting resulting from laser peening. The underlayer adheres to the surface of the workpiece to be peened and does not have bubbles and voids that exceed an acceptable size. One or more overlayers aer placed over and in contact with the underlayer. Any bubbles formed under the over layers are insulated from the surface to be peened. The process significantly reduces the incidence of pits on peened surfaces.
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