摘要：

Method and apparatus for introducing normally solid metals or metalloids into electrically conductive substrates. The invention is particularly useful in surface alloying of metal substrates and makes it possible to introduce such metals as tungsten into ferrous metal substrates to diffused depths of 100 microns and more without undue expense. The metal or metalloid to be introduced is maintained at an elevated temperature below the boiling point but equal to at least 40% of the melting point, the surface portion of the substrate is maintained at an elevated temperature below the deformation point, and a double glow discharge is employed under controlled conditions to transfer the metal or metalloid to the substrate.

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