Method of making sensitized polyimide polymers, having catalyst and electroless metal, metal deposits thereon and circuit patterns of various metallization schemes
申请(专利)号：
US05/724810
申请日期：
19760920
公开/公告号：
US04078096A
公开/公告日期：
19780307
申请(专利权)人：
AMP INCORPORATED
被引量：
摘要：
A method is disclosed for the generation of circuit patterns on a polyimide type of substrate by preconditioning the substrate's surface with a hydrazine/caustic solution, depositing a catalyst on the surface treated polymer, and exposing the polymer with the catalyst thereon to a bath having a metal therein capable of deposition electrolessly on the polymer surface containing catalyst.
展开
通过文献互助平台发起求助，成功后即可免费获取论文全文。
请先登入
相似文献
参考文献
引证文献
辅助模式
0
引用
文献可以批量引用啦~
欢迎点我试用！
