Surface treatment process

阅读量:

14

申请(专利)号:

US19850746388

申请日期:

1985-06-19

公开/公告号:

US4634600A

公开/公告日期:

1987-01-06

申请(专利权)人:

SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人:

Y ShimizuA Doi

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被引量:

142

摘要:

A substrate is treated for forming a thin film on the surface of the substrate to obtain a hard layer adhering to the substrate surface. For this purpose the substrate is placed in a metal vapor atmosphere and simultaneously bombarded by metal or nonmetal ions which are implanted into the substrate while the metal vapor atmosphere is also being ionized.

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引用走势

1995
被引量:16

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0

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