Structure and method for enhancing adhesion to a polyimide surface
申请(专利)号:
07/644063
申请日期:
01/22/1991
公开/公告号:
US5151304
公开/公告日期:
09/29/1992
申请(专利权)人:
International Business Machines Corporation (Armonk, NY)
被引量:
摘要:
The surface of a substrate made of substantially crystalline polyimide is converted to form a layer of substantially amorphous polyimide. The substantially amorphous layer is formed by treating the crystalline polimide surface with a base followed by treatment with an acid to form a polyamic acid layer, which is reimidized to form a substantially amorphous layer by a low temperature heat cycle. Metals or polyimides can be deposited onto this amorphous layer, which is then cured to convert the amorphous layer to substantially crystalline polyimide. This process enhances the adhesion of the metal or polyimide layer without introducing contamination (new foreign materials or new functional groups) from surface treatments of adhesion layers.
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