PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS
申请(专利)号：
ZA19870007006
申请日期：
1987-09-17
公开/公告号：
ZA877006B
公开/公告日期：
1988-03-23
申请(专利权)人：
MACDERMID, INCORPORATED
被引量：
摘要：
multilayer printed circuit plates are manufactured by preparing a first layer to form a standard image on a substrate surface provided by copper etching, removing unwanted copper.removing the reserve of the configuration of the circuit, and possibly applying a dielectric mask as a mask for welding portions of selected of the classic configuration of the circuit.a second layer, and, optionally, one or more layers thereon, forming an image is produced in a second circuit configuration in a predetermined location on the first layer, the image is formed by using a suspension of cuprous oxide in a red cross the polym u00e9risable resin.the image is then at least partially polymerized is subjected to chemical reduction to convert at least a portion of the copper oxide to metallic copper.the image is then plated with copper to form without the addition of the configuration of the circuit and is selectively coated with a dielectric mask before the cycle is repeated for one or more additional layers.the weld may be applied to selected areas of the layer of the printed circuit board or at any time during the manufacturing process.the process described above has the advantages of time saving, material saving and labour compared with the method used so far for multilayer plates which plates are manufactured individuellemen more simple and assembled in the form of a sandwich or a laminate by application of heat and pressure.
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