摘要：

Processes for preparing and treating a substrate are disclosed. A process includes: a) applying a cleaning solution comprising at least an organic acid to at least a portion of the substrate; (b) rinsing at least a portion of the cleaning solution with a first rinsing step; (c) applying a chemical cleaner composition onto a portion of the substrate subjected to step (b); (d) rinsing at least a portion of the substrate with the chemical cleaner composition of step (c) with a second rinsing step; and (e) depositing a pretreatment coating composition onto at least a portion of the substrate subjected to step (d). Additional steps include (f) rinsing at least a portion of the substrate with the pretreatment coating composition with a third rinsing step; and (g) depositing a protective coating composition onto the substrate subjected to step (f). Additional processes including similar steps in different arrangements are also disclosed.

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