摘要：

Child-resistant carded blister package and method of manufucture.A carded package includes a front card bonded to a rear card with a blister card captured therebetween. The blister card has upstanding blister compartments projecting through openings of the front card. The rear card extends over an opposite face of the blister card and is a laminate including a tear-resistant polymeric layer bonded to a paperboard layer. The polymeric layer extends adjacent the blister card and the paperboard layer of the laminate extends remote from the blister card forming an exposed surface of the rear card. The rear card includes perforations aligned behind the blister compartments. The perforations include a first set of perforations cut entirely through the paperboard and polymeric layers and a second set of perforations cut into the paperboard layer and not into or entirely through the polymeric layer. A method of assembling a carded package is also disclosed. ...- (USPTO) - , The Patent Description & Claims data below is from USPTO Patent Application 20120111761, Child-resistant carded blister package and method of manufucture.You can also Monitor Keywords and Search for tracking patents relating to this Child-resistant carded blister package and method of manufucture patent application.

展开