摘要：

A madril STAINLESS STEEL (10) is recorded to the pattern NEGATIVE (16) ELECTRICAL CIRCUIT TO BE DESIRED AND CONTINUING teflon covered (20) THEREAFTER IS PLUGGED TO PROVIDE AN AREA OF STEEL AND TEFLON COPLANAR. It is then formed a pattern of ELECTRICOS CONDUCTORES (30) by ELECTROLITEADO O electroplated, on the exposed surfaces (24) of material Tephon. SURFACES OF ELECTRICAL CONDUCTOR (30) of the circuit are processed as required to enhance adhesion to the substrate. Next, the laminated dielectric substrate (34) POLYAMIDE AND ACRYLIC ON THE madril OF electroformed conductors (30) surface so that the substrate dielectric (34) Adhere to the drivers. The assembly of the dielectric substrate (34) and conductors (30) is subsequently separated from surface PLANAR madril (10) AND COATED Tephon (16).

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