摘要：

and frequency multiplied Nd:YAG lasers for the drilling of polyester foils and glass fiber reinforced epoxy laminates with the aim of interconnect via preparation. The physics of processing using five wavelengths, i.e. 10600, 1064, 532, 355 and 266 nm, were modeled, examined and evaluated. Through contacting was carried out by screen-printing with polymer thick films, by wet chemical direct plating and by evaporation of thin metal layers, but the details of metallization are not given here. The conclusion refers to the possibilities and limitations of laser processing of polymeric materials in microelectronics packaging applications

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