Semiconductor manufacturing system with self-diagnosing function and self- diagnosing method thereof
申请(专利)号:
EP19940106691
申请日期:
1994-04-28
公开/公告号:
EP0628988A1
公开/公告日期:
1994-12-14
申请(专利权)人:
TOKYO SEIMITSU CO.,LTD.
被引量:
摘要:
A fine alignment section positions a reference wafer for inspecting the accuracy, delivers a cutting table by an interval value between the regular patterns, and a regular pattern position on the reference wafer for inspecting the accuracy is inspected at that time. An inspecting means compares the detected value by the fine alignment section with a true pattern position on the wafer to inspect the positioning accuracy of a semiconductor manufacturing system. Furthermore, the fine alignment section positions the reference wafer for inspecting the accuracy, delivers the cutting table by an interval between irregular pattern, and detects a irregular pattern position of the reference wafer for inspecting the accuracy at that time. The inspecting means compares the detected value detected by the fine alignment section with the true pattern position on the wafer to inspect the mechanical accuracy of the semiconductor manufacturing system.
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