摘要：

Polyimides are known to exhibit large ablation rates upon irradiation with excimer laser due to their high absorbance in the UV and low fluorescence yield. We have studied different regimes of laser ablation according to the fluence and studied the structures resulting from carbon products deposition. For fluences larger than the polyimide ablation threshold, but lower than the carbon one, the development of one structure is the dominant process, whereas large ablation rates lead to polyimide etching above the carbon ablation threshold. The deposition of a carbon layer on the walls of ablated slits has in particular been investigated using an original experimental technique. Optical microscopy and MEB have shown that this carbon layer covered the main height of the ablated holes whereas a threshold (bare polyimide) for carbon condensation was evidenced at the bottom of the ablated hole. Raman spectroscopy and conductivity measurements have shown that the carbon phase is mainly graphitic. A dependence of the carbon condensation threshold on the slit width has been evidenced and discussed in relation with the angle of ejection of ablation debris. A procedure has been developed to render the bare polyimide of the threshold region conductive. At last the conductive properties of the walls of the ablated holes have been exploited to perform an electrolytic metallization. Implications for the production of interconnection vertical interconnections (VIAs) in high density printed circuits are addressed.

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