METHOD OF CUTTING PLASTIC SUBSTRATE AND APPARATUS FOR CUTTING PLASTIC SUBSTRATE
申请(专利)号：
US12518453
申请日期：
20071029
公开/公告号：
US20100147814A1
公开/公告日期：
20100617
申请(专利权)人：
Noriko Watanabe
被引量：
摘要：
A laser emitter arranged to face a plastic substrate makes relative movement along a surface of the plastic substrate, while it is emitting a laser, so as to laser-cut the plastic substrate. In this process, a shield member is arranged outside a laser irradiation region on the plastic substrate.
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