摘要：

This report describes the work done in developing an interconnect capability for attaching to a tungsten metallized Al/sub 2/O/sub 3/ package a mounting clip used to hold small (0.051 mm thick x 6.35 mm in diameter) quartz crystal resonators in a nearly stress-free manner. This mounting chip serves as a mechanical support and an electrical connection to the outside of the package. The mount and its bond to the package must be strong enough to hold the crystal in place through a 1000 g 6 msec shock environment. The bonding techniques considered were ultrasonic, thermocompression, thermosonic, and parallel gap welding. The mounting materials evaluated were gold, gold plated kovar, nickel, elgiloy, paliney, and neyoro G. The gold ribbon was selected as the most suitable material, and the method of attach decided upon was parallel gap welding.

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