摘要：

Diazoquinone novolac resin-based positive resist that is exposed and aligned with step-and-repeat optical projection systems is still the most attractive imaging material for producing the micron and submicron feature sizes required for integrated circuit lithography. We discuss several aspects of positive-resist processing as they relate to step-and-repeat optical project systems. They include: vacuum vapor priming treatments, the spin-coating process, softbake process, step-and-repeat exposure system characteristics, alignment engineering requirements, the post-exposure bake process, the resist development process, post-develop resist treatments, resist stripping procedures, and resist-system selection considerations.

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