Soldering flux for circuit board and circuit board

阅读量:

39

申请(专利)号:

EP20010302940

申请日期:

2001-03-29

公开/公告号:

EP1149661A2

公开/公告日期:

2001-10-31

申请(专利权)人:

TAMURA KAKEN CORPORATION

发明人:

S AkaikeS SaitoT Ohno

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被引量:

94

摘要:

There is provided a soldering flux for circuit board, which is designed to be employed on an occasion of soldering electronic parts on a circuit board, the soldering flux being free from any organic solvent which may become a cause for contaminating air atmosphere and being capable of providing an excellent insulating property. This soldering flux comprises; a rosin-based modified resin having an acid value of not less than 100, a nondissociative activator formed of a nondissociative halogenide, and an aqueous solvent containing a volatile basic agent. There is also provided a circuit board having a flux film formed from such a soldering flux.

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