摘要：

In order to metallize ABS polymer surfaces without electroless plating, thin copper films were deposited by an internal magnet, coaxial cylindrical magnetron sputtering system. The adhesion of the metallized layers was evaluated by measuring peel strength. Average strength higher than 1 kg/cm was obtained with an appropriate process of metallizing. Several factors, which might influence the adhesion, such as conditions of sputtering, pretreatment of the polymer before sputtering, and the constitution of the polymer were studied. Oxygen plasma treatment before the metallization was found to improve the adhesion. Topographical change of the polymer surface was observed with SEM for the oxygen‐plasma‐treated substrate. Also, surface change in atomic constitution and chemical bonding energies were detected by ESCA and ir spectroscopy. It was found that the peel strength was higher for substrates of smaller butadiene content, which implied that tensile strength of polymer affected the peel strength of the metallized layer.

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