摘要：

The invention relates to a side light type LED backlight module. The backlight module comprises a light guiding plate made of a transparent material, an LED light source, a fluorescent film, and a transparent heat conducting material. At least one side of the light guiding plate is connected with support bars; and an accommodating space is formed between the light guiding plate and the support bars. The LED light source comprises a circuit board and a plurality of LED chips connected with the circuit board. The fluorescent film is arranged between the LED chips and the light guiding plate, and mixes the light rays emitted by the LED chips so as to produce white backlight or other required color backlights; and the LED light source and the fluorescent film are positioned inside the accommodating space. The transparent heat conducting material is filled in the accommodating space between the light guiding plate and the support bars. The LED backlight module integrally encapsulates a plurality of LED chips, thereby solving the problems of low light source density and insufficient brightness caused by the separately encapsulated LED chips in array. Consequently, the side light type backlight module is applied to large-scale ultra thin type LCD devices.

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