Films, Packages Prepared Therefrom, and Methods of Use

阅读量:

35

申请(专利)号:

US12091017

申请日期:

20061024

公开/公告号:

US20080273820A1

公开/公告日期:

20081106

申请(专利权)人:

Nathan J. Wiker Jose V. Saavedra

发明人:

NJ WikerJV Saavedra

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被引量:

14

摘要:

The invention relates to perforated films comprising at least one layer, and to packages prepared from the same. Such packages contain a combination of perforation sizes and perforation densities that allows for effective air removal, during a filling, conveying, and palletizing process, and especially during the pressurized filling of fine powder substances. In particular, the invention provides a perforated film, comprising at least one layer, and wherein the at least one layer comprises perforations that are individually of a size less than, or equal to, 100 microns (μm), and wherein the ratio of the total perforation area to the total film surface area is from 400,000 to 2,000,000 square micron per square inch of film (μm)/(in).

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