Adhesive bonding process
申请(专利)号：
US05/971611
申请日期：
19781220
公开/公告号：
US04363689A
公开/公告日期：
19821214
申请(专利权)人：
HENKEL CORPORATION
被引量：
摘要：
Products are prepared containing a radiation-sensitive reactive material and a saturated polyol. The product is used to bond films either through radiation or free radical initiation. The product is usable for bonding such films as polyester, polyvinylchloride, polyethylene, nylon or acrylonitrile-butadienestyrene copolymers.
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