Photosensitive composition

阅读量:

79

申请(专利)号:

US19960644395

申请日期:

1996-05-09

公开/公告号:

US5691101A

公开/公告日期:

1997-11-25

申请(专利权)人:

KABUSHIKI KAISHA TOSHIBA

发明人:

T UshirogouchiN ShidaT NaitoK AsakawaA HonguM NakaseH Niki

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被引量:

70

摘要:

Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin. This water-soluble photosensitive composition is coated on a substrate and irradiated with light or ionizing radiation in accordance with a desired pattern. The resultant substrate is chemically amplified by heating and developed with water. This makes it possible to safely form a pattern without using any ventilator.

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2003
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