摘要：

A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R 6 ) x Si(R 7 ) 4-x to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula R 8 N(R 9 ) 2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R 6 , R 7 , R 8 , R 9 and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.

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