Refractory solid, adhesive composition, and device, and associated method

阅读量:

26

申请(专利)号:

US20050155990

申请日期:

2005-06-17

公开/公告号:

US2005266263A1

公开/公告日期:

2005-12-01

申请(专利权)人:

JOHN ROBERT CAMPBELL;SANDEEP SHRIKANT TONAPI;ANANTH PRABHAKUMAR;DAVID ALEXANDER GIBSON;SLAWOMIR RUBINSZTAJN

被引量:

462

摘要:

A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.

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