Laser processing apparatus
申请(专利)号：
07/004265
申请日期：
01/09/1987
公开/公告号：
US4769523
公开/公告日期：
09/06/1988
申请(专利权)人：
Nippon Kogaku K.K. (Tokyo, JP)
被引量：
摘要：
A laser processing apparatus for projecting a spot of laser beam onto a portion of a microcircuit pattern on a semiconductor wafer, photographic mask or the like to cut the lead or anneal the limited area. The laser processing apparatus includes a mark detector for detecting the positions of first marks preliminarily provided on a work as the relative positions to the detection centers of the mark detector itself, a controller for controlling a processing energy beam generator so as to form on the work second marks detectable by the mark detector, and an error detector responsive to the results of the position detection of the second marks by the mark detector so as to detect relative positional errors between the focussing centers of the energy beam on the work and the detection centers of the mark detector.
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