Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
申请(专利)号：
EP19880113776
申请日期：
1988-08-24
公开/公告号：
EP0310803A1
公开/公告日期：
1989-04-12
申请(专利权)人：
GENERAL ELECTRIC COMPANY
被引量：
摘要：
A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.
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