Adhesive metallization of polyimide
申请(专利)号：
US06/449492
申请日期：
19821213
公开/公告号：
US04517254A
公开/公告日期：
19850514
申请(专利权)人：
SCHERING AKTIENGESELLSCHAFT
被引量：
摘要：
A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2- hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.
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